Mathematical Modeling of Drying Processes of Selected Fruits and Vegetables

This study investigates the behavior of fruit and vegetable samples during drying. The experimental data are fitted to several different thin-layer drying models. Regression analysis is used to determine model parameters, while statistical indicators serve to evaluate the goodness of fit. The power function model gives the best fit for all examined samples. Based on this model, different drying and heat storage technologies can be combined to ensure that the required residual moisture content of an agricultural product is reached. It is demonstrated on the case of a specific Togolese processing plant that under favorable conditions, fossil fuel consumption can be decreased by 33 %.     

Facile preparation and strong adhesive strength of honeycomb polyurethane films with small pore diameter

With the continuous development of bionics, such as, geckos and virginia creeper with both superhydrophobic and super-adhesive, the surface wetting and super-adhesive properties of various porous materials have attracted extensive attention of the scientific and medical communities. Here, the honeycomb polyurethane (PU) porous films with strong adhesion were successfully prepared by microphase separation method and the effects of growth parameters on their microstructure and adhesive strength to ice were investigated. It was found that a high relative humidity (e.g., 100%) and a low solution concentration (e.g., 2%) facilitated the formation of ordered honeycomb PU porous films, and as-prepared PU pores with average pore diameter as small as 5 μm are better ordered and more uniform than these in related documents. Although the contact angle of water droplets on the surface of PU porous films increased from the premodification value of 85–130° to more than 160° after surface modification with polydopamine (PDA), the corresponding rolling angle remained approximately constant (180°), indicating that the surface of PU porous films has strong adhesion similar to geckos and virginia creeper. Furthermore, at lower temperature, the PU porous films exhibited the high adhesive strength of 142.13 kPa on ice, which was strongly dependent on the porous microstructures and surface compositions. The improved adhesive behavior to ice of honeycomb PU porous films modified with PDA provides new strategies for surface modification of materials and potential applications in medical domain.     

Effect of Cu-Rich Phase Precipitation on the Microstructure and Mechanical Properties of CoCrNiCux Medium-Entropy Alloys Prepared via Laser Directed Energy Deposition

CoCrNiCux (x=0.16,0.33,0.75,and 1) without macro-segregation medium-entropy alloys (MEAs) was prepared using laser directed energy deposition (LDED).The microstructure and mechanical properties of CoCrNiCux alloys with increas-ing Cu content were investigated.The results indicate that a single matrix phase changes into a dual-phase structure and the tensile fracture behaviors convert from brittle to plastic pattern with increasing Cu content in CoCrNiCux alloys.In addi-tion,the tensile strength of CoCrNiCux alloys increased from 148 to 820 MPa,and the ductility increased from 1 to 11％with increasing Cu content.The nano-precipitated particles had a mean size of approximately 20 nm in the Cu-rich phase area,and a large number of neatly arranged misfit dislocations were observed at the interface between the two phases due to Cu-rich phase precipitation in the CoCrNiCu alloy.These misfit dislocations hinder the movement of dislocations during tensile deformation,as observed through transmission electron microscopy.This allows the CoCrNiCu alloy to reach the largest tensile strength and plasticity,and a new strengthening mechanism was achieved for the CoCrNiCu alloy.Moreover,twins were observed in the matrix phase after tensile fracture.Simultaneously,the dual-phase structure with different elastic moduli coordinated with each other during the deformation process,significantly improving the plasticity and strength of the CoCrNiCu alloy.     

玻璃纤维和硅酸钠复合对盐石膏性能的影响

盐石膏的水化强度极低,需通过添加外加剂来改善盐石膏的强度,本文通过在盐石膏中单掺玻璃纤维、硅酸钠及两者复合来改善盐石膏的性能.结果 表明,单掺玻璃纤维提高了盐石膏的强度,在纤维掺量为0.20％时,盐石膏的性能较佳;单掺硅酸钠缩短了盐石膏的凝结时间,提高了它的强度,在硅酸钠掺量为3％时,它的抗折强度和抗压强度较高;两者复合可显著改善盐石膏的强度等综合性能.分析表明,玻璃纤维像微钢筋一样穿插于石膏晶体中间,增加了晶体间的搭接;硅酸钠通过在石膏表面形成致密的硅酸钙层,使其硬化体结构变得致密,从而提高了盐石膏的强度.     

复合外加剂改性盐石膏的研究

盐石膏的主要成分为无水硫酸钙,其活性差、凝结硬化慢、强度低,需要添加活性剂来激发盐石膏的活性。通过复合外加剂对盐石膏加以改性,并通过XRD和SEM对其作用机理做了分析。结果表明,单掺脱硫石膏和建筑石膏均能缩短盐石膏的凝结时间,建筑石膏的效果较好,但掺量不宜过高。复掺建筑石膏和缓凝剂时,两者比例要控制得当,适宜的建筑石膏和缓凝剂掺量分别为50%和0.10%~0.12%（质量分数）。分析可知,大掺量建筑石膏会增加盐石膏硬化体中二水相和针棒状晶体的含量;缓凝剂掺量的增加,会降低盐石膏硬化体中二水相的含量,棱形晶体增多,从而降低了盐石膏的强度。     

硬孔攻丝用高性能先端丝锥的设计及应用

热后硬孔攻丝螺纹变形量小、尺寸稳定、强度高。该工艺方法对刀具强度要求较高,使用普通高速钢丝锥和螺纹铣刀加工时,普通高速钢丝锥无法承受热后硬孔攻丝所产生的大扭矩而频繁折断,报废率较高,同时螺纹铣刀成本高,不适合大批量生产。针对热后硬孔攻丝工艺复杂、成本高的问题,专门设计了硬孔攻丝用高性能先端丝锥,解决硬孔攻丝难题,并与其他种类丝锥进行了切削力对比。     

低比转速压气机轮毂轮缘型线多目标优化设计

对电动增压器用低比转速离心压气机轮毂轮缘进行优化设计。采用NUMECA/FINE Design 3D对压气机进行几何参数化,生成数据库样本,利用人工神经网络和遗传算法对轮毂轮缘型线进行优化,并进行流场分析。仿真结果表明,在设计转速为40000 r/min时,优化后设计点压比和效率分别提高6.59%和3.73%。     

热冲压工艺参数对22MnB5马氏体钢汽车B柱性能影响的有限元模拟

通过有限元仿真软件Autoform分析了热冲压过程中工艺参数的变化对22MnB5马氏体钢B柱起皱、回弹、减薄、马氏体量以及强度的影响。结果表明:22MnB5马氏体钢B柱热冲压最优化工艺参数为加热温度930 ℃,冷却速率80 ℃/s。该工艺参数下,热冲压过程各处均完成马氏体转变,硬度分布均匀,材料减薄率较低,热冲压成形效果好,尺寸精度高,冲压件强度均大于1400 MPa。     

High-Tg porous polyimide films with low dielectric constant derived from spiro-(adamantane-2,9′(2′,7′-diamino)-fluorene)

Porous polyimide (PI) films with low dielectric constants and excellent thermal properties have been a pressing demand for the next generation of high-performance, miniature, and ultrathin microelectronic devices. A series of novel porous PI films containing fluorenyl-adamantane groups were prepared successfully via thermolysis of poly(ethylene glycol) (PEG) added in the PI matrix. The cross-sectional morphologies of porous PI films showed closed pores with diameters ranging from 135 to 158 nm, which were uniform and regular in shape without interconnectivity. These porous PI films exhibited excellent thermal properties with a glass-transition temperature at 376 °C whereas the 5% weight loss temperature in air excess of 405 °C due to enhanced rigidity afforded by fluorenyl-adamantane groups. Accompanied by thermolysis content of PEG increasing from 0 to 20 wt %, the density of porous PI films decreased, and the corresponding porosity grew significantly from 0 to 11.48%. Depending on porosity, the dielectric constant and dielectric loss of porous PI films significantly declined from 2.89 to 2.37 and from 0.050 to 0.021, respectively. These excellent properties benefit the as-prepared porous PI films for application as interlayer dielectrics, integrated circuit chips, or multichip modules in microelectronic fields. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019 , 136, 47313.